In the field of electronic device manufacturing, with the rapid development of technology, electronic components are constantly evolving towards miniaturization and high performance, which places extremely stringent requirements on the packaging materials of electronic components. Diamond micropowder, with its excellent physical properties, plays a crucial role in electronic component packaging, becoming a key factor in improving the stability and reliability of electronic devices.

I. Background of Electronic Component Packaging Needs

1. 1. Thermal Challenges of Electronic Components
   • (1) During the operation of electronic devices, electronic components generate a large amount of heat due to the passage of current. Taking the CPU of a high-performance computer as an example, its power can reach 100 watts or even higher during high-load operation. If such high power consumption cannot be dissipated effectively and promptly, it will cause the CPU temperature to rise sharply. When the temperature exceeds a certain threshold, the electron migration phenomenon inside the CPU will intensify, the performance of the transistors will decrease, which will lead to calculation errors, reduce the operating speed, and may even cause permanent damage.
   • (2) For mobile devices such as smartphones, the internal space is extremely compact, and electronic components are densely arranged. The heat generated by multiple heat sources such as batteries, processors, and chipsets is superimposed, making the heat dissipation problem even more prominent. If heat dissipation is poor, it will not only affect the performance of the device but also shorten the battery life and reduce the user experience.
2. 2. Requirements for Packaging Materials
   • (1) To solve the heat dissipation problem of electronic components, the packaging material needs to have excellent thermal conductivity, which can quickly conduct the heat generated by the components. At the same time, considering the complex circuit structure inside electronic devices, the packaging material must also have good insulation properties to prevent short circuits between different circuits and ensure the safe and stable operation of electronic devices. Traditional packaging materials, such as plastics and ordinary ceramics, often fail to meet the heat dissipation requirements of high-performance electronic components in terms of thermal conductivity.

II. Characteristics and Advantages of Diamond Micropowder in Electronic Component Packaging

1. 1. Ultra-high Thermal Conductivity
   • (1) Diamond has the highest thermal conductivity in nature, and its thermal conductivity at room temperature can reach 2000-2200 W/(m·K), which is about 5 times that of copper. Diamond micropowder inherits this excellent characteristic of diamond and, when used as a packaging material, can efficiently conduct the heat generated by electronic components.
   • (2) When diamond micropowder is applied to electronic component packaging, it is usually compounded with other matrix materials. For example, when preparing thermal grease for CPU packaging, diamond micropowder with a particle size of 1-10 microns is uniformly dispersed in matrix materials such as organosilicon resin. These tiny diamond particles form efficient heat conduction paths in the matrix. When the CPU generates heat, the heat can quickly be transferred through the diamond micropowder to the surrounding environment, greatly improving the heat dissipation efficiency.
2. 2. Good Insulation
   • (1) While having excellent thermal conductivity, diamond micropowder also has good insulation performance. Its resistivity is extremely high, reaching 10¹⁶-10¹⁸Ω·cm, which can effectively prevent current conduction and prevent electrical interference between electronic components. In the complex circuit environment inside electronic devices, this insulation characteristic is crucial.
   • (2) For example, in the chip packaging process, applying packaging material containing diamond micropowder around the chip can quickly dissipate the heat generated by the chip and ensure electrical isolation between the chip and other circuit components, avoiding equipment failures due to leakage current, etc., providing reliable protection for the stable operation of electronic components.

III. Application Examples of Diamond Micropowder in CPU Packaging

1. 1. Preparation and Application of Packaging Materials
   • (1) In the CPU packaging of high-performance computers, in order to fully utilize the heat dissipation advantages of diamond micropowder, advanced material preparation processes are usually used. First, diamond micropowder with high purity and uniform particle size is selected, and after surface treatment, it can better combine with the matrix material. Then, the treated diamond micropowder is mixed with matrix materials such as epoxy resin at a certain ratio, and an appropriate amount of additives is added. Through high-speed stirring, ultrasonic dispersion, and other processes, a uniform and stable heat dissipation packaging material is prepared.
   • (2) During the packaging process, this packaging material containing diamond micropowder is precisely applied to the contact surface between the CPU chip and the heat sink. Due to the high thermal conductivity of diamond micropowder, the heat generated by the CPU chip can be quickly transferred to the heat sink through the packaging material, and then the heat sink dissipates the heat to the surrounding air.
2. 2. Improvement Effect on CPU Performance
   • (1) By using packaging materials containing diamond micropowder, the operating temperature of the CPU has been significantly reduced. Under high-load operation, compared with using traditional packaging materials, the CPU temperature can be reduced by 10-15℃. The lower operating temperature makes the performance of the transistors inside the CPU more stable, reducing the occurrence of electron migration and other phenomena.
   • (2) This directly leads to an improvement in CPU operating speed and stability. Experimental data show that after using diamond micropowder packaging materials, the operating speed of the CPU in complex tasks such as multi-core computing and graphics processing can be improved by 10%-15%, and the stability of the system has also been greatly enhanced. The occurrence of crashes, blue screens, and other failures during long-term operation has been significantly reduced, effectively improving the overall performance and user experience of high-performance computers.